Electrical Engineering 143: Microfabrication Technology (Fall 2014, UC Berkeley). Instructor: Professor Clark Tu-cuong Nguyen.
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September 25, 2023
English
English [CC]
Description
Microfabrication Technology - Integrated circuit device fabrication and surface micromachining technology. Thermal oxidation, ion implantation, impurity diffusion, film deposition, epitaxy, lithography, etching, contacts and interconnections, and process integration issues. Device design and mask layout, relation between physical structure and electrical/mechanical performance. MOS transistors and poly-Si surface microstructures will be fabricated in the laboratory and evaluated.
Course Curriculum
- Lecture 05 – Process Module Overview, Process Integration: NMOS Process Unlimited
- Lecture 06 – Process Integration: Example NMOS Process, Masks and Alignment Unlimited
- Lecture 07 – Masks and Alignment, Four Main Components of Lithography Unlimited
- Lecture 08 – Lithography: Masks and Alignment, Design Rules, Resolution Unlimited
- Lecture 09 – Lithography: Resolution, Linewidth Control/ Thermal Oxidation of Silicon Unlimited
- Lecture 10 – Oxidation: Theory, Graphs Unlimited
- Lecture 11 – Oxidation: Graphs, Dopant Redistribution/ Film Deposition: Evaporation Unlimited
- Lecture 12 – Film Deposition: Sputtering, Chemical Vapor Deposition Unlimited
- Lecture 13 – Film Deposition: CVD, ALD/ Metal Electroplating/ Etching Unlimited
- Lecture 14 – Etching: Selectivity, Wet Etching, Dry Etching Unlimited
- Lecture 15 – Etching: Dry Etching, Chemical Mechanical Polishing/ Ion Implantation Unlimited
- Lecture 16 – Ion Implantation: The Basic Process, I/I Statistics, Junction Depth Unlimited
- Lecture 17 – Diffusion: Basic Process for Selective Doping Unlimited
- Lecture 18 – Diffusion: Predeposition, Diffusion Modeling Unlimited
- Lecture 19 – Diffusion: Successive Diffusions Unlimited
- Lecture 20 – Diffusion: Determining Junction Depth, Sheet Resistance, Measuring Resistance Unlimited
- Lecture 21 – Interconnects and Contacts Unlimited
- Lecture 22 – Interconnects and Contacts (cont.), CMOS Process Unlimited
- Lecture 23 – CMOS Process Flow, Metal MEMS, Advanced Isolation Unlimited
- Lecture 24 – Advanced Isolation (cont.), MOS CV Unlimited
- Lecture 25 – MOS CV, Vt Implant Unlimited
- Lecture 26 – Device Characterization Unlimited
About the instructor
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