Micro and Smart Systems. Instructors: Prof. K. N. Bhat, Prof. G. K. Ananthasuresh, Prof. S. Gopalakrishnan, and Dr. K. J. Vinoy, Department of Electrical Communication Engineering, IISc Bangalore.
1111 years
40
This interdisciplinary course not only gives an overview of the micro and smart systems technologies but also gives an in-depth understanding of the issues involved. It begins by answering the important question: why miniaturize? This is followed by a quick summary of a variety of sensors, actuators, and systems. It then presents a comprehensive description of microfabrication. This is followed by a detailed discussion of mechanics of solids as it pertains to micro and smart systems. While this part may be viewed as strength of materials and design, an effort is made to relate this to micro devices and discuss such topics as residual stress and stress gradients, lumped modeling using energy methods, anticlastic curvature, etc. The discussion ends with general equations of elasticity and their solution is discussed next using the finite element method. Here, too the basics and advanced topics are interleaved to provide a thorough understanding of the finite element method. After this, electronics circuits, control, and packaging are also presented. (from nptel.ac.in)
Course Currilcum
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- Lecture 01 – Glimpses of Microsystems: Scaling Effects Unlimited
- Lecture 02 – Smart Materials and Systems Unlimited
- Lecture 03 – Microsensors Unlimited
- Lecture 04 – Microactuators Unlimited
- Lecture 05 – Microsystems: Some Examples Unlimited
- Lecture 06 – Smart Systems Application and Structural Health Monitoring Unlimited
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- Lecture 07 – Microfabrication Technologies Unlimited
- Lecture 08 – Thin Film Materials and their Deposition Unlimited
- Lecture 09 – Approaches for Pattern Transfer Unlimited
- Lecture 10 – Surface Micromachining of Microstructures Unlimited
- Lecture 11 – Bulk Micromachining of Microsystems Unlimited
- Lecture 12 – Extended Approaches for Working Microsystems Unlimited
- Lecture 13 – Non-conventional Approaches for Microsystems Unlimited
- Lecture 14 – Packaging of Microsystems Unlimited
- Lecture 15 – Deformation Strains and Stresses Unlimited
- Lecture 16 – Microdevice Suspensions: Lumped Modeling Unlimited
- Lecture 17 – Residual Stress and Stress Gradients Unlimited
- Lecture 18 – Torsion and Twist Unlimited
- Lecture 19 – Vibrations of Microsystems Devices Unlimited
- Lecture 20 – Vibrations of Microsystems Devices: Micromachined Gyroscopes Unlimited
- Lecture 21 – Vibrations of Microsystems Devices, Modeling of Coupled Electrostatic Microsystems Unlimited
- Lecture 22 – Modeling of Coupled Electrostatic Microsystems (cont.) Unlimited
- Lecture 23 – Coupled Electrothermal-elastic Modeling Unlimited
- Lecture 24 – Modeling of Microsystems: Scaling Effects Unlimited
- Lecture 31 – Semiconductor Device Physics Unlimited
- Lecture 32 – BJT and MOSFET Characteristics and Op-Amps Unlimited
- Lecture 33 – Op-Amp Circuits and Signal Conditioning for Microsystems Devices Unlimited
- Lecture 34 – Control and Microsystems Unlimited
- Lecture 35 – Vibration Control of a Beam Unlimited
- Lecture 36 – Signal Conditioning Circuits and Integration of Microsystems and Microelectronics Unlimited
- Lecture 37 – Pressure Sensor Design Concepts, Processing, and Packaging Unlimited
- Lecture 38 – Pressure Sensor Design Concepts, Processing, and Packaging (cont.) Unlimited
- Lecture 39 – Capacitive Micro-accelerometer Unlimited
- Lecture 40 – Capacitive Micro-accelerometer (cont.) Unlimited
