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An Introduction to Electronics Systems Packaging. Instructor: Prof. G. V. Mahesh, Department of Electronic Systems Engineering, IISc Bangalore.
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Description
The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging. The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level. The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered. (from nptel.ac.in)
Course content
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- Lecture 01 – Introduction and Objectives of the Course Unlimited
- Lecture 02 – Definition of a System and History of Semiconductors Unlimited
- Lecture 03 – Products and Levels of Packaging Unlimited
- Lecture 04 – Packaging Aspects of Handheld Products; Case Studies in Applications Unlimited
- Lecture 05 – Case Studies (cont.), Definition of PWB, Summary and Questions for Review Unlimited
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- Lecture 06 – Basic of Semiconductor and Process Flowchart Unlimited
- Lecture 07 – Wafer Fabrication, Inspection and Testing Unlimited
- Lecture 08 – Wafer Packaging; Packaging Evolution; Chip Connection Choices Unlimited
- Lecture 09 – Wire Bonding, TAB and Flip Chip Unlimited
- Lecture 10 – Wire Bonding, TAB and Flip Chip (cont.) Unlimited
- Lecture 11 – Why Packaging? and Single Chip Packages or Modules (SCM) Unlimited
- Lecture 12 – Commonly Used Packages and Advanced Packages; Materials in Packages Unlimited
- Lecture 13 – Advanced Packages; Thermal Mismatch in Packages; Current Trends in Packaging Unlimited
- Lecture 14 – Multichip Modules Types; System-In-Package; Packaging Roadmaps; Hybrid Circuits Unlimited
- Lecture 19 – Quick Tutorial on Packages; Benefits from CAD; Introduction to DFM, DFR and DFT Unlimited
- Lecture 20 – Components of a CAD Package and its Highlights Unlimited
- Lecture 21 – Design Flow Considerations; Beginning a Circuit Design with Schematic Work Unlimited
- Lecture 22 – Demo and Examples of Layout and Routing; Technology File Generation from CAD Unlimited
- Lecture 32 – SMD Benefits; Design Issues; Introduction to Soldering Unlimited
- Lecture 33 – Reflow and Wave Soldering Methods to Attach SMDs Unlimited
- Lecture 34 – Solders; Wetting of Solders; Flux and its Properties; Defects in Wave Soldering Unlimited
- Lecture 35 – Vapour Phase Soldering; BGA Soldering and Desoldering Repair; SMT Failures Unlimited
- Lecture 36 – SMT Failure Library and Tin Whiskers Unlimited
- Lecture 37 – Tin-lead and Lead-free Solders; Phase Diagrams; Thermal Profiles for Reflow … Unlimited
- Lecture 38 – Lead-free Solder Considerations; Green Electronics; RoHS Compliance Unlimited
- Lecture 40 – Introduction to Embedded Passives; Need for Embedded Passives, … Unlimited
- Lecture 41 – Embedded Capacitors; Processes for Embedding Capacitors Unlimited
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