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An Introduction to Electronics Systems Packaging. Instructor: Prof. G. V. Mahesh, Department of Electronic Systems Engineering, IISc Bangalore.

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September 25, 2023

UK

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Last updated:

September 25, 2023

Duration:

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FREE

This course includes:

Unlimited Duration

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Description

An Introduction to Electronics Systems Packaging. Instructor: Prof. G. V. Mahesh, Department of Electronic Systems Engineering, IISc Bangalore.

The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging. The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level. The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered. (from nptel.ac.in)

Course Curriculum

    • Lecture 01 – Introduction and Objectives of the Course Unlimited
    • Lecture 02 – Definition of a System and History of Semiconductors Unlimited
    • Lecture 03 – Products and Levels of Packaging Unlimited
    • Lecture 04 – Packaging Aspects of Handheld Products; Case Studies in Applications Unlimited
    • Lecture 05 – Case Studies (cont.), Definition of PWB, Summary and Questions for Review Unlimited
    • Lecture 06 – Basic of Semiconductor and Process Flowchart Unlimited
    • Lecture 07 – Wafer Fabrication, Inspection and Testing Unlimited
    • Lecture 08 – Wafer Packaging; Packaging Evolution; Chip Connection Choices Unlimited
    • Lecture 09 – Wire Bonding, TAB and Flip Chip Unlimited
    • Lecture 10 – Wire Bonding, TAB and Flip Chip (cont.) Unlimited
    • Lecture 11 – Why Packaging? and Single Chip Packages or Modules (SCM) Unlimited
    • Lecture 12 – Commonly Used Packages and Advanced Packages; Materials in Packages Unlimited
    • Lecture 13 – Advanced Packages; Thermal Mismatch in Packages; Current Trends in Packaging Unlimited
    • Lecture 14 – Multichip Modules Types; System-In-Package; Packaging Roadmaps; Hybrid Circuits Unlimited
    • Lecture 15 – Electrical Issues: Resistive Parasitic Unlimited
    • Lecture 16 – Electrical Issues: Capacitive and Inductive Parasitic Unlimited
    • Lecture 17 – Electrical Issues: Layout Guidelines and the Reflection Problem Unlimited
    • Lecture 18 – Electrical Issues: Interconnection Unlimited
    • Lecture 19 – Quick Tutorial on Packages; Benefits from CAD; Introduction to DFM, DFR and DFT Unlimited
    • Lecture 20 – Components of a CAD Package and its Highlights Unlimited
    • Lecture 21 – Design Flow Considerations; Beginning a Circuit Design with Schematic Work Unlimited
    • Lecture 22 – Demo and Examples of Layout and Routing; Technology File Generation from CAD Unlimited
    • Lecture 23 – Review of CAD Output Files for PCB Fabrication; Photoplotting and Mask Generation Unlimited
    • Lecture 24 – Process Flow-Chart; Vias; PWB Substrates Unlimited
    • Lecture 25 – Substrates (cont.); Surface Preparation Unlimited
    • Lecture 26 – Photoresist and Application Methods; UV Exposure and Developing Unlimited
    • Lecture 27 – PWB Etching; Resist Stripping; Screen Printing Technology Unlimited
    • Lecture 28 – Through-hole Manufacture Process Steps; Panel and Pattern Plating Methods Unlimited
    • Lecture 29 – Solder Mask for PWBs; Multilayer PWBs; Introduction to Microvias Unlimited
    • Lecture 30 – Microvia Technology and Sequential Build-Up Technology Process Flow for … Unlimited
    • Lecture 31 – Conventional vs HDI Technologies; Flexible Circuits Unlimited
    • Lecture 32 – SMD Benefits; Design Issues; Introduction to Soldering Unlimited
    • Lecture 33 – Reflow and Wave Soldering Methods to Attach SMDs Unlimited
    • Lecture 34 – Solders; Wetting of Solders; Flux and its Properties; Defects in Wave Soldering Unlimited
    • Lecture 35 – Vapour Phase Soldering; BGA Soldering and Desoldering Repair; SMT Failures Unlimited
    • Lecture 36 – SMT Failure Library and Tin Whiskers Unlimited
    • Lecture 37 – Tin-lead and Lead-free Solders; Phase Diagrams; Thermal Profiles for Reflow … Unlimited
    • Lecture 38 – Lead-free Solder Considerations; Green Electronics; RoHS Compliance Unlimited
    • Lecture 39 – Thermal Design Considerations in System Packaging Unlimited
    • Lecture 40 – Introduction to Embedded Passives; Need for Embedded Passives, … Unlimited
    • Lecture 41 – Embedded Capacitors; Processes for Embedding Capacitors Unlimited
    • Lecture 42 – Exclusive Chapter Wise Summary Unlimited

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