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Description
2.830J/6.780J Control of Manufacturing Processes (SMA 6303) (Spring 2008, MIT OCW). Taught by Prof. David Hardt and Prof. Duane Boning, this course explores statistical modeling and control in manufacturing processes.
Topics include the use of experimental design and response surface modeling to understand manufacturing process physics, as well as defect and parametric yield modeling and optimization. Various forms of process control, including statistical process control, run by run and adaptive control, and real-time feedback control, are covered. Application contexts include semiconductor manufacturing, conventional metal and polymer processing, and emerging micro-nano manufacturing processes. (from ocw.mit.edu)
Course Curriculum
- Lecture 01 – Introduction – Processes and Variation Framework Unlimited
- Lecture 02 – Semiconductor Process Variation Unlimited
- Lecture 03 – Mechanical Process Variation Unlimited
- Lecture 04 – Probability Models of Manufacturing Processes Unlimited
- Lecture 05 – Probability Models, Parameter Estimation, and Sampling Unlimited
- Lecture 06 – Sampling Distributions and Statistical Hypotheses Unlimited
- Lecture 07 – Shewhart SPC and Process Capability Unlimited
- Lecture 08 – Process Capability and Alternative SPC Methods Unlimited
- Lecture 09 – Advanced and Multivariate SPC Unlimited
- Lecture 10 – Yield Modeling Unlimited
- Lecture 11 – Introduction to Analysis of Variance Unlimited
- Lecture 12 – Full Factorial Models Unlimited
- Lecture 13 – Modeling Testing and Fractional Factorial Models Unlimited
- Lecture 14 – Aliasing and Higher Order Models Unlimited
- Lecture 15 – Response Surface Modeling and Process Optimization Unlimited
- Lecture 16 – Process Robustness Unlimited
- Lecture 17 – Nested Variance Components Unlimited
- Lecture 18 – Sequential Experimentation Unlimited
- Lecture 19 – Case Study 1: Tungsten CVD DOE/RSM Unlimited
- Lecture 20 – Case Study 2: Cycle to Cycle Control Unlimited
- Lecture 21 – Case Study 3: Spatial Modeling Unlimited
- Lecture 22 – Case Study 4: Modeling the Embossing/Imprinting of Thermoplastic Layers Unlimited
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