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Created by:
Last updated:
May 1, 2022
Duration:
Unlimited Duration
FREE
This course includes:
Unlimited Duration
Badge on Completion
Certificate of completion
Unlimited Duration
Description
Microelectronics has enabled designers of integrated circuits to exercise complete control over the electrical characteristics of each component they create.
This course, Structural devices, will illustrate how such control is achieved and the various methods that can be applied in differing circumstances.
Course learning outcomes
After studying this course, you should be able to:
- Understand how to relate physical dimensions and materials properties to static and dynamic behaviour
- Demonstrate an awareness of how small features are cut out in solid materials, and how small features are built up in solid materials
- Describe the piezoelectric effect and its use for producing small-scale movement in mechanical devices
- State the relative significance of different forces at very small scales
- Identify key factors that influence the behaviour of mechanical vibrating and resonant systems.
Course Curriculum
- Introduction 00:03:00
- Learning outcomes 00:10:00
- Structural devices: a static role 00:20:00
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- Introduction 00:30:00
- The challenge for innovation 00:15:00
- The fabrication process for a MEMS Pirani sensor 01:00:00
- Thermal and electrical conductance 00:45:00
- Review 00:30:00
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- Introduction 00:15:00
- The principles of scanning probe microscopes 00:20:00
- The scanning tunnelling microscope 00:25:00
- The atomic force microscope 00:10:00
- Scanning modes of the AFM 00:15:00
- Contact mode 00:10:00
- Non-contact (tapping) mode 00:15:00
- Lateral force (friction) mode 00:15:00
- Other modes 00:25:00
- Design considerations for AFM probes 00:15:00
- Stiffness 00:30:00
- Resonant frequency 00:40:00
- Quality of resonance 00:10:00
- Materials selection for cantilevers 00:40:00
- The machined-at-once tip and cantilever 00:40:00
- The hybrid probe 00:07:00
- Oxidation sharpening 00:15:00
- The carbon-nanotube tip 00:20:00
- Review 00:10:00
- Stickiness 00:30:00
- London forces 00:05:00
- Dipole-dipole forces 00:10:00
- Introduction 00:20:00
- Film properties 00:05:00
- Thickness control and uniformity 00:30:00
- Step coverage (conformality) 00:25:00
- Chemical composition 00:15:00
- Microstructure 00:20:00
- Stress 00:15:00
- Depositing metals and alloys 00:10:00
- Electroplating 00:10:00
- Evaporation 00:15:00
- Plasmas 00:10:00
- Physical vapour deposition (PVD), sputtering 00:25:00
- Ion beam deposition 00:10:00
- Laser ablation deposition 00:10:00
- Depositing compounds 00:10:00
- Spin-on 00:10:00
- Reactive PVD 00:20:00
- Chemical vapour deposition (CVD) 00:30:00
- Plasma-enhanced CVD (PECVD) 00:10:00
- Atomic layer deposition (ALD) 00:15:00
- Molecular beam epitaxy (MBE) 00:10:00
- Deposition of patterned films: lift-off and damascene 00:20:00
- Fluorine-based etching of silicon 00:10:00
- Sputter etching: argon ion etching of gold 00:30:00
- Reactive ion etching: chlorine/argon plasma etching of aluminium 00:30:00
- Etchants and protectants: sulphur hexafluoride/oxygen plasma etching of siliconL 00:30:00
- Alternative plasma chamber designs: MERIE and ICP 00:30:00
- Deep silicon etching 00:30:00
- Stopping the etch 00:10:00
- Open-loop control 00:10:00
- Closed-loop control 00:30:00
- Self-limiting etches 00:45:00
- Review 00:45:00
- Conclusion 00:03:00
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